Film Attachment Device | Manual Mounting Machine FM-224 Series
Starting with research and development, a wide range of equipment selection is possible according to the purpose, up to semi-production applications.
The wafer mount / tape mount is a tape application device that instantly adheres "wafers," "dicing frames," and various films/tapes without bubbles. It allows for the easy application of uniform tape to wafers, which is considered important in the dicing process. TechnoVision's wafer mount offers a wide range of equipment options tailored to various purposes, from research and development to semi-production applications. The manual type wafer mount is available in three work sizes: - 300mm (12 inches) - 200mm (8 inches) - 150mm (6 inches) (Free demo units are also available for loan.) Additionally, there are devices with specifications tailored for specific applications, such as dicing and back grinding. The application targets are not limited to wafers; the device can accommodate various workpieces such as packages, glass, ceramics, and more. Custom solutions can also be flexibly provided to meet users' special specifications.
- Company：TECHNOVISION, INC. main office
- Price：Other
